姜霖
副教授
教育/工作经历
2025.01– 至今 东北大学 信息科学与工程学院 副教授、博士生导师
2024.03– 2025.01 香港科技大学 电子与计算机工程博士后
2019.09 – 2023.12 克拉克森大学电子与计算机工程博士
2016.09 - 2019.06 中国科学技术大学 材料工程 硕士
2012.09 - 2016.06 武汉大学 材料工程 学士
研究方向
高性能多核芯片热管理；
芯片自动化（EDA）设计；
3D异构集成芯片性能和可靠性协同优化；
面向植入式医疗电子设备的低功耗电路设计；
利用降阶模型、有限元方法、物理驱动神经网络模型的多物理场耦合的模拟计算。
招收博士/硕士方向
招收专业：集成电路，微电子，计算机体系架构等方向。
招生条件：对上述方向感兴趣，数学和代码能力强，有主动探索、勇于突破知识边界的热情和毅力。
欢迎感兴趣的同学邮件联系，邮件标题请注明“硕/博士申请+毕业学校+姓名”，并附上个人简历。
科研项目
a)多物理耦合场下三维异构集成芯片热-可靠性感知优化设计研究，辽宁省博士启动项目， 2026.1-2027.12。主持
b)Research on the Technology for Integration and Optimization of Chiplet Architecture，深港澳科技计划A类项目，2023.1-2025.12。参与
c)An Effective Thermal Simulation Methodology for GPGPUs Enabled by Data-Driven Model Reduction（Grant No. ECCS-2003307.），美国NSF。 参与
d)High Performance Computing with Engineering Application（Grant No. CSE-2118079.），美国 NSF。参与
学术成果
期刊论文
1． Lin Jiang, Anthony Dowling, et al.,“PODTherm-GP: A Physics-based Data-Driven Approach for Effective Architecture-Level Thermal Simulation of Multi-Core CPUs”IEEE Transaction on Computers, Vol. 72, no. 10, (2023): 2951-2962. (CCF-A).
2． Lin Jiang, Yu Liu, et al., “Full-Chip Dynamic Thermal Simulation with High Accuracy and Fine Resolution based on Model Order Reduction” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 42, no. 8, (2023): 2675-2688. (CCF-A).
3． Lin Jiang, Anthony Dowling, et al., “Ensemble Learning Model for Effective Thermal Simulation of Multi-core CPUs” Integration, the VLSI journal, Vol. 97 (2024): 102201.(CCF-C).
4． Lin Jiang, Liang Zhang, et al., “Effects of Al Interlayer and Ni (V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly.” Acta Metall Sin, Vol. 56, no. 10 (2020): 1433-1440.
5． Lin Jiang, Liang Zhang, et al., “Optimal design of Co/In/Cu sputtering target assembly using finite element method and taguchi method.” Acta Metallurgica Sinica (English Letters), Vol. 32, no. 11 (2019): 1407-1414.
6． Anthony Dowling, Lin Jiang, et al., “Regulating CPU Temperature with Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model.”Future Generation Computer Systems,(2024):107687.(CCF-C)
7． Anthony Dowling, Lin Jiang, et al, “TDF: A compact file format plugin for FEniCS.” SoftwareX, Vol. 22, (2023): 101329.
8． Pulimeno Alessandro, Graham Coates-Farley, Martin Veresko, Lin Jiang, Ming-Cheng Cheng, Yu Liu, and Daqing Hou*, Physics-driven proper orthogonal decomposition: A simulation methodology for partial differential equations. MethodsX, Vol. 10, (2023): 102204
会议论文
1. Chaofang Ma, Lin Jiang,et al.,“ScanNow: A Scan Window-Based Sparse Matrix Multiplication Accelerator Design”, In IEEE/ACM International Conference on Computer-Aided Design (ICCAD). pp 1-9, 2025.(CCF-B)
2. Lin Jiang, Yu Liu, et al., “Predicting Accurate Hot Spots in a More Than Ten-Thousand-Core GPU with a Million-Time Speedup over FEM Enabled by a Physics-based Learning Algorithm.” In 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm). pp. 1-7, 2024.
3. Lin Jiang, Martin Veresko, et al., “An Effective Physics Simulation Methodology Based on a Data-Driven Learning Algorithm” In Proceedings of the Platform for Advanced Scientific Computing Conference (PASC), pp. 1-10, 2022.
4. Lin Jiang, Dowling, Anthony, et al., “Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs” In 2022 IEEE International Symposium on Circuits and Systems (ISCAS), pp. 278-282, 2022.
5. Lin Jiang, Dowling, Anthony, et al, “Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition” In 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) pp. 1-7, 2022. (Best Paper Award).
6. Lin Jiang, Yu Liu, and Ming-C. Cheng*, An Effective and Accurate Data-Driven Approach for Thermal Simulation of CPUs. In 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), pp. 1008-1014, 2021.
专利
1 刘志权姜霖陈胤伯刘畅. 一种三明治结构Co靶材背板扩散焊组件中间层的选取方法[P]. CN201910687276.4.
2 刘兴海冯程琛许琦炀姜霖陈楚雄陈政杰韩晓雪黎厚斌. 一种主动调控角度的Kirigami结构VO2智能窗及其搭设方法和应用[P]. CN202310766311.
获奖
2022年IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems会议最佳论文奖。
联系方式
办公室：信息楼524
电话：
邮箱：jianglin1@neu.edu.cn
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